DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BGY148A; BGY148B
HF amplifier modules
1998 May 13
Product specification
Supersedes data of 1997 Jul 14
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
CHARACTERISTICS
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; VC ≤ 3.5 V; Tmb = 25 °C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN.
frequency range
TYP. MAX. UNIT
f
BGY148A
BGY148B
400
−
−
−
−
−
−
53
−
−
−
−
−
440
488
100
500
−
−
−
−38
−38
3 : 1
−
MHz
MHz
µA
µA
W
430
−
−
IQ
total quiescent current
control current
load power
VC = 0; PD = 0
IC
adjust VC for PL = 3 W
PL
Gp
η
H2
H3
3
power gain
adjust VC for PL = 3 W
adjust VC for PL = 3 W
adjust VC for PL = 3 W
adjust VC for PL = 3 W
adjust VC for PL = 3 W
VC = 0 to 3.5 V
24.8
46
−
−
−
dB
efficiency
%
second harmonic
third harmonic
input VSWR
control range
stability
dBc
dBc
VSWRin
10
−
dB
PD = 5 to 20 mW; VS = 5 to 8.5 V;
PL ≤ 3.5 W;
VSWR ≤ 4 : 1 through all phases
−60
dBc
ruggedness
VS = 8.5 V; adjust VC for PL = 3.5 W;
no degradation
VSWR ≤ 4 : 1 through all phases
MDA207
5
handbook, halfpage
P
L
(W)
4
VSWR = 1:1
3
2
VSWR = 3:1
1
0
0
20
40
60
80
T
100
o
( C)
mb
VS = 8.5 V.
Fig.2 Load power derating curves.
1998 May 13
3
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
MGD553
MGD554
5
60
handbook, halfpage
handbook, halfpage
P
L
η
(%)
(W)
4
400 MHz
440 MHz
440 MHz
400 MHz
40
20
3
2
1
0
0
0
0
1
2
3
4
1
2
3
4
P
(W)
V
(V)
L
C
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C.
Fig.3 Load power as a function of control voltage;
BGY148A; typical values.
Fig.4 Efficiency as a function of load power;
BGY148A; typical values.
MGD555
MGD556
5
60
handbook, halfpage
handbook, halfpage
P
L
η
(%)
(W)
4
40
3
2
20
1
0
0
380
380
400
420
440
460
400
420
440
460
f (MHz)
f (MHz)
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; VC = 3.5 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.
Fig.5 Load power as a function of frequency;
BGY148A; typical values.
Fig.6 Efficiency as a function of frequency;
BGY148A; typical values.
1998 May 13
4
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
MGD557
MGD558
4
−30
3.0
handbook, halfpage
V
C
(V)
VSWR
H
H
3
in
2,
(dBc)
2.5
3
−40
H
3
VSWR
in
2.0
1.5
1.0
2
H
2
V
C
−50
1
0
380
−60
380
400
420
440
460
400
420
440
460
f (MHz)
f (MHz)
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 3 W; Tmb = 25 °C.
Fig.7 Control voltage and input VSWR as functions
of frequency; BGY148A; typical values.
Fig.8 Harmonics as a function of frequency;
BGY148A; typical values.
MDA206
5
handbook, halfpage
P
L
(W)
4
400 MHz
440 MHz
3
2
1
0
−25
0
25
50
75
T
100
o
( C)
mb
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.9 Load power as a function of mounting base
temperature; BGY148A; typical values.
1998 May 13
5
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
MGD559
MGD560
5
60
handbook, halfpage
handbook, halfpage
P
430 MHz
L
η
(W)
(%)
4
430 MHz
488 MHz
488 MHz
40
20
3
2
1
0
0
0
0
1
2
3
4
1
2
3
4
P
(W)
V
(V)
L
C
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; Tmb = 25 °C.
Fig.10 Load power as a function of control voltage;
BGY148B; typical values.
Fig.11 Efficiency as a function of load power;
BGY148B; typical values.
MGD561
MGD562
5
60
handbook, halfpage
handbook, halfpage
P
L
η
(%)
(W)
4
40
3
2
20
1
0
0
420
420
440
460
480
500
440
460
480
500
f (MHz)
f (MHz)
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; VC = 3.5 V; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.
Fig.12 Load power as a function of frequency;
BGY148B; typical values.
Fig.13 Efficiency as a function of frequency;
BGY148B; typical values.
1998 May 13
6
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
MGD563
MGD564
4
−30
3.0
handbook, halfpage
V
C
(V)
H
H
3
2,
VSWR
in
(dBc)
2.5
3
−40
H
2
V
C
2.0
1.5
1.0
2
1
−50
−60
−70
H
3
VSWR
in
0
420
440
460
480
500
420
440
460
480
500
f (MHz)
f (MHz)
ZS = ZL = 50 Ω; PD = 10 mW; VS = 6 V; PL = 3 W; Tmb = 25 °C.
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; PL = 3 W; Tmb = 25 °C.
Fig.14 Control voltage and input VSWR as functions
of frequency; BGY148B; typical values.
Fig.15 Harmonics as a function of frequency;
BGY148B; typical values.
MDA205
5
handbook, halfpage
P
L
(W)
4
430 MHz
3
488 MHz
2
1
0
−25
0
25
50
75
T
100
o
( C)
mb
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.16 Load power as a function of mounting base
temperature; BGY148B; typical values.
1998 May 13
7
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MGM159
300
handbook, halfpage
Advised solder types are types with a liquidus less than or
T
(°C)
equal to 210 °C.
Solder dots or solder prints must be large enough to wet
the contact areas.
200
100
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 °C and damage the module.
0
0
The maximum allowed temperature is 250 °C for
5 seconds.
1
2
3
4
5
t (min)
The maximum ramp-up is 10 °C per second.
The maximum cool-down is 5 °C per second.
Fig.17 Recommended reflow temperature profile.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1998 May 13
8
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
22.6
2
DETAIL
0.8
0.4
1.7
1.5
2
8.45
0.6
1
2.9
2.7
2.7
0.1
1.1
1.1
2.4
2.6
0.1
7.48
15.1
DETAIL
0.5
0.7
MGK391
20.18
footprint metallization
solder area.
21.8
2
2
0.8
2
7.05
1.7
3.2
2
1.8
7.08
14.7
MGK392
19.78
solder area.
Dimensions in mm.
Fig.18 SOT421A footprint.
9
1998 May 13
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
PACKAGE OUTLINE
Ceramic single-ended flat package; 4 in-line leads
SOT421A
U
D
A
y
Z
E
U
1
L
Q
1
2
3
4
b
w
M
c
e
e
e
d
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
d
E
e
e
L
Q
U
U
w
y
Z
1
1
3.0 0.56 0.30 22.1 2.4 13.4
2.6 0.46 0.20 21.7 2.0 13.0
0.7
0.3
3.4 22.4 8.2
3.0 22.0 7.8
0.25
0.05
0.25
mm
5.08 7.62
0.15
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT421A
97-06-20
1998 May 13
10
Philips Semiconductors
Product specification
HF amplifier modules
BGY148A; BGY148B
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 May 13
11
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© Philips Electronics N.V. 1998
SCA60
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125108/00/03/pp12
Date of release: 1998 May 13
Document order number: 9397 750 03849
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